发明名称 FLATTENING MATERIAL AND FLATTENING METHOD
摘要 PURPOSE:To enable an element material to be flattened without any defect due to the heat fusibility of resist and to prevent the surface of the material from being roughed when it is etched back, by employing a material basically constituted by a compound produced by the reaction between a water-soluble organic material and an aldehyde or ketone compound. CONSTITUTION:The employed material is basically constituted by a compound produced by the reaction between a water-soluble organic material and an aldehyde or ketone compound. For example, the basic compound consists of a main polymer of a water-soluble organic material such as polysaccharide, protein, polyvinyl pyrolidone or gelatine, or a water-soluble organic material produced exogeneously by the biotechnology such as polysaccharide, protein, casein or the like pullulan for example and an aldehyde or ketone compound as a crosslinking agent which is hemiacetal-, acetal-, hemiketal-, or ketal-bonded with an OH radical of the main polymer.
申请公布号 JPS61222226(A) 申请公布日期 1986.10.02
申请号 JP19850064142 申请日期 1985.03.28
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ENDO MASATAKA;SASAKO MASARU;TAKEYAMA KENICHI;NOMURA NOBORU
分类号 C08L3/00;C08L3/08;C08L101/00;H01L21/302;H01L21/3065 主分类号 C08L3/00
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