| 摘要 |
PURPOSE:The titled composition excellent in heat shock resistance and moisture resistance, comprising a specified epoxy resin, a novolak phenolic resin, PS or a styrene/vinyl compound copolymer and an organic phosphine compound. CONSTITUTION:100pts.wt. epoxy resin (A) having at least two epoxy groups in the molecule (e.g., bisphenol A diglycidyl ether) is melt-kneaded with 40-65 pts.wt. novolak phenolic resin (B) of a softening point of 60-120 deg.C and a hydroxyl equivalent of 100-150, 1-20pts.wt. PS or styrene/vinyl compound (e.g., acrylonitrile) copolymer (C) of an average particle diameter of 0.2-30mum and 0.01-20 pts.wt. organic phosphine compound (D) (e.g., trimethylphosphine).
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