| 摘要 |
PURPOSE:To enable a work to stop a carrier at the same position as that on which the work is initially mounted by providing a portion of work to be detected in a predetermined position of the carrier holding the work to detect that portion by a sensor after the completion of polishing. CONSTITUTION:When a wafer 13... is charged in a receiving hole 14... of a carrier 11 to be attached between upper and lower surface plates 19, 18, the carrier 11 is rotatably driven by a guide gear 17 while the upper and lower surface plates 19, 18 reciprocate in the opposite direction by a drive mechanism 26 to each other through reverse feed gears 24, 25 for polishing. And in the completion of polishing light is irradiated from a luminescent element to a light receiving element 16b, and when a light sensor detecting hole 16 of the carrier 11 coincides with said element, it is detected by said element 16b. Thus, all drive sources are stopped and the wafer 13... charged in the carrier 11 is stopped at the position in which it is initially mounted on the lower surface surface 20. Thus, works to be polished can be securely and easily controlled. |
