METHOD OF SEALING SEMICONDUCTOR CHIP

摘要

PURPOSE:To prevent the resin sealing from being deviated positionally or from being performed in a defective manner, by correctly locating a pellet-shaped resin on an unmounted semiconductor chip, temporarily fixing it on the chip and then melting the resin completely to seal the chip. CONSTITUTION:A pellet resin 5 within a resin magazin 9 is pushed down by a pushing pin 10 acting from the upside and disposed on an unmounted semiconductor chip 4. The hybrid integrated circuit substrate 2 is heated concentrically in the portion where the unmounted semiconductor chip 4 is carried, whereby the pellet resin 5 located correctly on the unmounted semiconductor chip 4 is partially melted and temporarily secured to the hybrid integrated circuit substrate 2. The substrate is further fed into a tunnel-type heating furnace 14 so that the temporarily secured resin 5 is completely melted to seal the unmounted semiconductor chip 4.