发明名称 SEMICONDUCTOR MANUFACTURING EQUIPMENT
摘要 PURPOSE:To enable the simultaneous loading of plural resin tablets and the proper mold shaping by aligning the plural resin tablets in advance according to the arrangement of plural small ports provided for a molding die and loading the whole arranged tablets into the die while retaining such arranging condition. CONSTITUTION:The resin tablets 11 in a part feeder 10a are carried to the side of a release device 18 in order and fall on an alignment table 19 from a chuck part 17 one by one. The alignment table 19 is shifted toward the right in order by a motor 21 and a screw shaft 23 so that the resin tablets 11 are contained in the alignment holes 19a on the side of first row. When the all resin tablets 11 are put in the holes 19a of the row A side, a cylinder 53 is actuated to swing a lever 54. Then as a table 20 is pressed through a roller 54, the alignment table 19 shifts backward and the alignment holes 19a of the row B side shift to beneath the chuck part 17. After that, the resin tablets 11 fall in turn from the chuck part 17 and are contained in the alignment holes 19a of the row B side similarly.
申请公布号 JPS61214439(A) 申请公布日期 1986.09.24
申请号 JP19850055194 申请日期 1985.03.19
申请人 OKI ELECTRIC IND CO LTD 发明人 NAKANO TOSHIO;TAMURA MASAHIRO
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/18;B29K101/10;B29L31/34 主分类号 H01L21/56
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