发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the slipping-off and looseness of the inner leads from generating due to the expansion of the resin by a method wherein each lead-out part of the leads for wiring of a sealing resin body is provided with protrusion parts and the volume of a part of each lead, where a lead is supported by the resin, is decreased. CONSTITUTION:Leads 2 are flat. Due to this, the expansion of the resin from the X-direction to the Y-direction largely exerts an effect on the slipping-off and looseness of inner leads 2b. Therefore, spaces 1b are provided between the adjacent leads 2 in the X-directions of the lead-out parts of the leads 2. By the spaces 1b, the expansion of the resin in the protrusion parts 1a, particularly in the Y-direction, is suppressed. the inner end of each inner lead 2b is provided with an extendedly spread part 3c, a notch 3b is provided in each protrusion part 1a and the generation of the slipping-off and looseness is prevented. In addition, space parts can be further provided up and down in the Y-directions.
申请公布号 JPS61214545(A) 申请公布日期 1986.09.24
申请号 JP19850056642 申请日期 1985.03.20
申请人 TOSHIBA CORP 发明人 SEITO TSUTOMU
分类号 H01L23/50;H01L23/28;H01L23/495 主分类号 H01L23/50
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