Device for making through-contact in the case of holes in thick-film circuit boards

摘要

A device for making through-contact in the case of holes in thick-film circuit boards, solder paste being applied to a perforated mask using a screen-printing method, and the solder paste being sucked through the thick-film board by means of a reduced pressure which is applied on a reduced-pressure supply which is provided underneath the thick-film board. The thick-film board is arranged such that it is sealed over its surface on a bearing perforated board (13) which is perforated to correspond to the thick-film board (15). Provided at a distance underneath the bearing perforated board (13) is a further compensated perforated board (7) whose gas permeability, per square centimetre, is approximately the same as the thick-film board (15). The reduced-pressure supply to a reduced-pressure chamber (1) takes place in a pulsed manner underneath the further compensated perforated board.