| 摘要 |
<p>Disclosed is a method of mounting electronic parts onto a single-sided printed wiring board, including the provision of a key contact pattern on the front surface of a substrate member having a plurality of through-holes; the provision of a conductive pattern covering these through-holes on the front surface of the substrate member; and the mounting of electronic parts in position relative to these through-holes from the rear surface of the substrate member.</p> |
