| 摘要 |
A method of manufacturing a carrier tape for use in the continuous production of integrated circuits includes the formation of finger leads and sprocket holes in a metallic foil tape. The method includes the steps of stamping perforations adjacent the edges of the tape (Step B), coating both sides of the tape with a photoresist layer (6) (Step C), and then exposing the photoresist layers to light which has passed through a patterned mask (Step D). Sensitized or non-sensitized portions (7,8) of the photoresist layers are dissolved (Step E), and the uncovered portions of the metallic foil tape etched away (Step F) to leave a carrier tape which after dissolving the remaining photoresist, comprises a tape of a required width having apertures corresponding to finger lead patterns and sprocket hole patterns embodied in the original mask. By providing perforations in the margins of the starting material, the tape can be accurately located during the exposure step without having to pre-form sprocket holes. Such pre-formed sprocket holes are liable to be damaged in the exposure step, leading to inaccuracies when integrated circuit chips are brought into contact with the finger leads. The method can be applied to the manufacture of several carrier tapes formed side-by-side from a single, relatively wide metallic foil tape material. |
