| 摘要 |
PURPOSE:To prevent the generation of cracks, by installing the conductive pattern formed on the ceramic substrate, the semiconductor elements, the coupling layer of resin formed on the surface of ceramic substrate except the conductive pattern, and the enclosure made of resin. CONSTITUTION:On the surface of the ceramic substrate 21, the conductive pattern is formed, on which photo-semiconductor elements are arranged, and moreover on the ceramic substrate 21, the enclosure made of resin is installed. The thin coupling layer 25 is formed on the whole surface of the ceramic substrate 21 except the conductive pattern 22. Thus, the ceramic substrate and the resin forming the enclosure 26 stick together so tightly that the generation of cracks on the boundary surface can be prevented. |
