| 摘要 |
<p>PURPOSE:To prevent the voids of an Al wiring electrode by overlapping and connecting an Al wiring layer in a non-wire bonding section in a barrier metallic layer. CONSTITUTION:An electrode pad at the end section of an Al wiring 3 is formed by a barrier metallic layer 4 overlapped to an Al pad section 2. A gold fine wire 1 is connected on the metallic layer 4 through ball bonding. Consequently, a distance between the edge end of the pad section 2 and the ball bonding section of the fine wire 1 is lengthened, and the reaction time of these pad section and ball bonding section is retarded. Accordingly, the voids of a wiring 3 electrode are prevented.</p> |
