| 摘要 |
PURPOSE:To separate wafers one at the same time, by facing input/output ports of the wafers on carriers, adjusting the heights of the carriers, providing a back to back state of several tens of the wafers at the same time, and using a threshold plate and a pushing plate. CONSTITUTION:A carrier is set so that the surface of a wafer faces upward on a left frame 2a. Another carrier is set so that the surface of a wafer faces downward on a right frame 2b. Then the height of the right frame 2b is adjusted so that the wafer 9 in the carrier 8 set on the right frame 2b is lower than the wafer 9 in the carrier 8 set on the left frame 2a facing above described wafer. A threshold plate 4 is removed, and a pushing plate 3a is pushed-in. Then, the carrier on the left frame 2a is moved on the wafer in the carrier on the right frame 2b. The wafers are overlapped in a back t back state in the carrier on the right frame. When a pushing plate 3b is pushed in, the upper wafer is moved into the carrier on the left frame 2a. But the lower wafer is stopped by the threshold plate 4 so that the wafer does not go out of the carrier. |
