| 摘要 |
PURPOSE:To prevent wirings from damaging, improperly contracting and shortcircuiting by electrically contacting a bonding pad and inner leads by linear conductors. CONSTITUTION:An insulating layer 5 is formed around a semiconductor pellet 2. The insulating layer on the pellet 2 is removed, and the forming surface of the bonding pad 6 of the pellet 2 and the surface 4' of inner leads 4 are continued by the exposing surface 5' of the layer 5. A metal film 7 is formed on the surface 5', the pad 6 and the surface 4' of the leads 4. A portion unnecessary to electrically connect the pad 6 to the leads 4 of the film 7 is removed. The entirety is sealed with molding resin 10. Thus, it can prevent wirings from damaging, improperly contacting and shortcircuiting. |
