| 摘要 |
PURPOSE:To equalize effective areas on soldering among electrode patterns, and to eliminate the need for the variation of the position of soldering by forming constriction sections to long-sized electrode patterns. CONSTITUTION:A constriction section 3 partitioning the surface of a long-sized electrode pattern (No.1 terminal) 1 shaped to a chip carrier package 4 is formed at a position in the same length as other electrode patterns 2 on the electrode pattern 1, and effective sections on soldering on two kinds of the electrode patterns 1, 2 in different length are equalized. The constriction section 3 can be shaped easily through screen printing, etc. The flow of solder adhering on the electrode pattern 1 for No.1 terminal is stopped by the constriction section 3 on soldering, thus contracting and limiting the effective section on soldering within a range corresponding to the same length as other electrode patterns 2. Accordingly, the effective sections on soldering on the electrode patterns 1, 2 in different length are kept within the same length range, and effective areas thereof are made the same, thus no displacing in the long direction of the central section of a solder sagging even through pre-soldering, then eliminating the need for the change of the position of soldering of a substrate. |
