| 摘要 |
PURPOSE:To eliminate any unfavorable effect on circuits in an IC by a method wherein all of lead terminals disconnected to inner circuits provided on an integrated circuit are grounded. CONSTITUTION:All of lead terminals N disconnected to inner circuit provided on an IC package are grounded. Besides, in case of forming a wiring pattern, any disconnected bonding pads are to be automatically connected to a grounding conductor L0. Through these procedures, any static breakdown may be prevented from occurring while improving the shield effect, diminishing any induction nose such as crosstalk etc. and reinforcing the noise resistance to stabilize the IC circuit. |
