发明名称 Method of making three dimensional semiconductor devices in selectively laser regrown polysilicon or amorphous silicon layers
摘要 Herein disclosed is a semiconductor device having at least one lower resistance region formed in the single-crystalline semiconductor film which is so formed to continuously coat both a single-crystalline semiconductor substrate and an insulating film formed on the surface of the substrate. Since the aforementioned single-crystalline semiconductor film is used, many advantages which are not attained from the semiconductor device according to the prior art can be obtained. The aforementioned single-crystalline semiconductor film is formed by irradiating a polycrystalline or amorphous semiconductor film with a laser beam.
申请公布号 US4609407(A) 申请公布日期 1986.09.02
申请号 US19830563036 申请日期 1983.12.19
申请人 HITACHI, LTD. 发明人 MASAO, TAMURA;KOZUKA, HIROTSUGU;WADA, YASUO;OHKURA, MAKOTO;HIROSHI, TAMURA;TOKUYAMA, TAKASHI;OKABE, TAKAHIRO;MINATO, OSAMU;OHBA, SHINYA
分类号 H01L21/268;H01L21/822;H01L27/02;H01L27/06;H01L29/04;(IPC1-7):H01L21/265;H01L21/26 主分类号 H01L21/268
代理机构 代理人
主权项
地址