| 摘要 |
PURPOSE:To reduce any coating unevenness in the spin-coating process by a method wherein a turbine wheel is mounted encircling a wafer to locate it on the central part of the turbine wheel so that the turbine wheel may be turned forcing the atmosphere therein to flow from the turning center to the peripheral part. CONSTITUTION:Photoresist is dripped on the surface of a semiconductor wafer 2 and then the wafer 2 is turned centering on the central axle of a spin chuck 1 to form a specified photoresist coating film meeting the specified requirements. At this time, a turbine wheel 5 is turned making the atmosphere above the semiconductor wafer 2 flow from the turning center to the peripheral part to be exhausted. Through these procedures, even and excellent photoresist coating film may be formed stably in the continuous processing of wafers since the photoresist may be prevented from bouncing upon the surface of semiconductor wafer 2 within the processing cup while making the atmosphere above the semiconductor streadily flow from the turning center to the peripheral part. |
