发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To make an air cross-over part of an upper layer winding mechanically firm and reduce a capacity between the wirings by forming the air cross- over part into a shape of a corrugated plate. CONSTITUTION:An upper layer winding 5 is formed over linear patterns 4. An air bridge of the wiring 5 is formed into a shape of a corrugated plate so that the bending strength of the longitudinal direction of the wiring 5 is improved. With this method, the air cross-over part is mechanically strengthened and a capacity between the wirings is reduced.
申请公布号 JPS61194851(A) 申请公布日期 1986.08.29
申请号 JP19850035786 申请日期 1985.02.25
申请人 NEC CORP 发明人 ONODA TAKANORI
分类号 H01L23/522;H01L21/768;(IPC1-7):H01L21/88 主分类号 H01L23/522
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