发明名称 FORFARANDE ATT FRAMSTELLA TUNNA LEDANDE OCH HALVLEDANDE SKIKT I ENKRISTALLINT KISEL
摘要 A method for producing thin conductive or semiconductive layers embedded in silicon in the manufacture of structures for integrated circuits and the like. The invention is characterized by implanting metal atoms (14) in a silicon substrate (15) to a pre-determined nominal depth, and subsequently causing the implanted metal atoms to be redistributed, to form a conductive or a semiconductive layer (16), by heat-treating the silicon substrate (15).
申请公布号 SE8603652(D0) 申请公布日期 1986.08.29
申请号 SE19860003652 申请日期 1986.08.29
申请人 STIFTELSEN INSTITUTET FOR MIKROVAGSTEKNIK VID TEKNISKA .. 发明人 S * PETERSON
分类号 H01L29/872;H01L21/265;H01L21/3205;H01L21/74;H01L23/52;H01L29/47;H01L29/68;H01L29/80 主分类号 H01L29/872
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