| 摘要 |
In the fabrication of micro-electronic circuits, it is often necessary to arrange a number of patterned surfaces be well insulated from each other. At the same time, however, the pattern edges of the layer to be overlaid must present a defined slope angle of between the range of forty to sixty degrees, for example. The invention solves this problem through a two stage coating process in which a polymer is first applied which coats the edges and is then coated with a photoresist having good leveling properties. |
