| 摘要 |
PURPOSE:To form a uniform electroless plating film by using alkaline condition in an activation treatment stage and improving further a pretreatment stage for a material to be plated in the stage of forming electroless plating on the surface of an insulating substrate. CONSTITUTION:The insulating substrate consisting of ceramics, plastic, etc. is first treated with an aq. soln. of an aminosilane coupling agent. The substrate is more preferably treated with ammonium persulfate soln. and is further treated with hydrogen peroxide soln., sodium borohydride and the soln. added with 0.05-2% polyoxyethylene octyl phenyl ether or the like as a surface active agent thereto and sulfuric acid. The substrate is successively treated with the soln. contg. the complex obtd. by dissolving chloride, fluoride, boromid, nitrate, sulfate, etc. such as Pd(II), Ag(I), CU(I) to an amide such as formamide and thereafter the substrate is immersed in a reducing soln. such as formamide to deposit metallic particles of Pd, Ag, Cu, etc. The substrate is immersed in an electroless plating liquid of Cu, Ni, etc., by which the electroless plating film of Cu, Ni, etc., is formed. |
