| 摘要 |
PURPOSE:To decide whether operation is normal or not, and to find the malfunction of a machine device which machines an object early and prevent a defective from being produced by comparing picked-up images of the object before and after operation with each other. CONSTITUTION:When, for example, a semiconductor element is wire-bonded, a lead frame 2 is connected to the semiconductor element 1, external leads are wired, and electrodes 5 and 4 are connected. Their image is picked up through a microscope optical system and the video signal of a TV camera is led to an image device. At this time, the image device extracts an image (c) of a part where there is variation owing to operation by using an image (a) before the wire bonding and an image (b) after the wire bonding. Then, a thin-line image (d) is obtained by image processing such as line thinning processing, line tracking, terminal-point coordinate tracking. Then, it is decided whether the operation is normal or not from the image (c) and line-thinned image (d). Thus, the difference between the images before and after the operation is detected, so it is easily decided whether the operation is normal or not. |
