| 摘要 |
PURPOSE:To obtain the superior adhesion and electrical connectability of amorphous Si by a method wherein a coated layer of Au, Ag, Pd, Rh, Pt or In, each having a specified thickness, or an alloy of one and the other one of these metals is provided on a stainless steel substrate. CONSTITUTION:An alkaline degreasing and an electrolytic degreasing, and moreover, a pretreatment needed for electroplating, such as an activating treatment according to acid, are performed on a stainless steel substrate with its surface being adjusted in the desired surface configuration by cold rolling, machine polishing or electrolytic composite polishing and so forth. After that, Au, Ag, Pd, Rh, Pt or In, or an alloy of one and the other one of these metals is electroplated in the thickness of 0.05mum or less. When the thickness is thicker more than 0.05mum, the eutectoid of impurities of hydrogen, an additive, salts, water and so forth generates and the sound formation of a layer of amorphous Si is impaired. When the thickness is the plating thickness of 0.05mum or less, the accumulation of the impurities is small, the release of gas at the time of the temperature rise of the substrate is also small, as the layer itself is remarkably thin, and no defect generates. The plating thickness in practical use is desirably 0.005 mum-0.01mum. |
