| 摘要 |
PURPOSE:To reduce the thermal capacity of silicon chip while preventing any warp or distortion from occuring by a method wherein a silicon wafer substrate is arranged with irregular grid type reinforcing ribs. CONSTITUTION:Within a silicon wafer substrate 1 arranged with grid type protective films 3 on the other side, reinforcing ribs 1a are formed by means of etching the substrate 1 utilizing anode electrolytic grinding process leaving the silicon wafer part arranged with the grid type protective films 3 only. Through these procedures, any warp or distortion of the silicon wafer substrate 1 may be reinforced by means of arranging the other side of silicon wafer substrate 1 with irregular grip type reinforcing ribs 1a etched utilizing the anode electrolytic grinding process. |
