发明名称 PARTIAL PLATING DEVICE
摘要 PURPOSE:To maintain uniform plating conditions and to obtain a uniform film thickness by providing a prescribed plating liquid supply port and discharge port to a recess provided to the surface of a mask plate which contacts tightly with a body to be plated so that the plating liquid flows along the plating surface. CONSTITUTION:A backing plate 34 is pressed to the rear of the plate-shaped body to be plated and the mask plate 30 is pressed to the front thereof. Said body is partly plated. The recess is formed to the surface of said mask plate 30 on the side where the mask plate contacts with the body to be plated. The plating liquid supply port 40 is provided on the inside wall of the recess and the plating liquid discharge port 50 is provided in the position on the opposite side thereof with the recess in-between. The plating liquid is run along the surface of the body to be plated. The top ends of, for example, leads 10 are thus plated by the flow of the plating liquid to the uniform film thickness.
申请公布号 JPS61183472(A) 申请公布日期 1986.08.16
申请号 JP19850024002 申请日期 1985.02.09
申请人 SHINKO ELECTRIC IND CO LTD 发明人 AMARI YOSHIO;TSUCHIYA KENICHIRO;KITAZAWA KIYOSHI
分类号 C23C18/16;C23C18/31;C23C18/44;C25D5/02 主分类号 C23C18/16
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