SOLID-STATE IMAGE PICKUP DEVICE

摘要

PURPOSE:To prevent the generation of blooming by a method wherein an aluminum film is provided over the back of a chip, which is put and arranged in a package of cavity structure without conduction parts. CONSTITUTION:The back of a chip 6 is provided with an aluminum film 12 which is arranged by adhesion to the package bottom 1b via adhesive 13. The surface end of the chip 6 is provided with bonding pads 8' which are connected to the bonding pads 4' of a conductive metallic pattern 3' arranged at a package step 1a and are electrically connected to terminals 5'. A required voltage is impressed on the terminals 5'. Accordingly, the film 12 provided over the back of the chip 6 comes to be connected to the bonding pads 8' with an imaginary resistor 14 of the chip 6 N-substrate. Although some voltage drops are caused thereby, the resistance of the film 12 can be substantially neglected. Therefore, voltage can be uniformly impressed over the substrate of the chip 6 in the presence of the film 12.