| 摘要 |
<p>The dual-in-line package integrated circuit package has the free ends of its connection pins formed into a U-shape, with an inwardly-pointing circular section and a horizontal foot. The foot section does not extend further than the outer surface of the connection pin. In this way, each conductor of the package may be soldered to the conducting tracks of a printed circuit board, or a thin or thick film circuit, while allowing minimal spacing between opposite sets of conductors. The mounting method permits inspection of the soldered joints after assembly, and permits flexing of the lead-out pins resulting from vibration or change of temperature. A socket, adapted to receive the U-shaped section of the deformed pins may be mounted on the substrate permitting removable mounting of the integrated circuit package.</p> |
