| 摘要 |
A solder-bearing lead useful as a terminal or contact which may be fabricated by rapid progressive stamping techniques is disclosed in which side ears are formed on the contact blank, and then bent upwardly out of their initial plane. These ears are formed to hold a solder mass in a position where the solder can confront the conductive area to which the lead is to be soldered, permitting convenient surface mounting of components having such leads, on a substrate, and permitting convenient connection of terminals to other components or substrates.
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