| 摘要 |
PURPOSE:To increase polishing efficiency and achieve mass production in a polishing apparatus for a die to be used in injection molding by selectively imparting reciprocating movement and rotational movement to a polishing tool so as to perform polishing along a work surface and further moving the polishing tool vertically. CONSTITUTION:This polishing apparatus is composed of a supporting mechanism 1, a polishing mechanism 2 supported by the supporting mechanism 1, a driving mechanism 3 for driving the polishing mechanism 2, a workpiece holding mechanism 4 fixedly secured to the supporting mechanism 3, and a control mechanism 5 for controlling the supporting mechanism 1, driving mechanism 2, workpiece holding mechanism 4 and elevating mechanism 12. Adjusting means 52 is connected to the lower end of a rotatingly driven main spindle 18 in such a manner that the eccentric amount is adjustable, and gripper means 53 for gripping a polishing tool 20 is attached to the adjusting means 52 slidably in a plane substantially perpendicular to the axis of the main spindle 18, and movement changeover means 54 selectively imparts rotational movement and linearly reciprocating movement to the gripper means 53. Further, elevating means 22 imparts vertical movement to the polishing tool 20, and a pressing means 21 presses the polishing tool 20 against a workpiece at a constant pressure. |
