| 摘要 |
PURPOSE:To obtain the titled composition capable of enduring to conditions of an electroless copper plating by incorporating a high polymer compd. contg. a cinnamoyl group, a photosensitizer, a coloring agent, a solvent and a thermoplastic resin or an epoxy resin to the titled composition. CONSTITUTION:The titled composition comprises the high polymer compd. contg. the cinnamoyl group, the photosensitizer, the coloring agent, the solvent and the thermoplastic resin or the epoxy resin as an improver of the chemical resistance. The high polymer compd. contg. the cinnamoyl group comprises a polycinnamic acid vinyl ester etc. The thermoplastic resin comprises a polysulfone, a polyether sulfone, a phenoxy resin etc. The compounding ratio of the titled composition is 10-30wt% the polycinnamic acid vinylester, 10-30wt% the thermoplastic resin or the epoxy resin, 0.03-1.5wt% the photosensitizer, 0.1-0.5wt% the coloring agent and a residual amount of a solvent such as xylene and a cellosolve acetate etc. |
