发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable conduction tests of high efficiency by a method wherein pellet wirings are formed close to the conduction test wirings for said wirings, and switches which can be set in conduction during a conduction test and in cut-off after pellet mount are provided between both wirings. CONSTITUTION:Pellet wirings 12, 12a connecting pads are electrically cut by electrode pads 13, 13a in a state of no pellet mount; therefore, a time of probe test makes it impossible to perform the conduction test of the wirings 12, 12a. Then, a conduction test wiring 14 is additionally formed between the electrode pads 13 and 13a, and switches 15 are provided between the wiring 14 and the pads 13, 13a. This construction enables the switches 15 to be turned on only during the conduction test of wirings and off in normal states. Accordingly, mother chips can be offered to the manufacture of the title device after the wirings are subjected to satisfactory conduction test before pellet 6 mount.
申请公布号 JPS61177739(A) 申请公布日期 1986.08.09
申请号 JP19850018539 申请日期 1985.02.04
申请人 HITACHI LTD 发明人 ISHII SHUICHI
分类号 H01L21/3205;H01L21/66;H01L21/822;H01L23/52;H01L27/04 主分类号 H01L21/3205
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