| 摘要 |
PURPOSE:To automate the exfoliation of a wafer and its discharge work by providing an exfoliating means having a cutter intruding between a wafer and a plate, and a chuck to hold the exfoliated wafer and transfer it to a discharge position. CONSTITUTION:A wafer 25 after ground is carried to a predetermined machining place by a transfer means 2, together with a plate 11, and during the rotation of an index table 3 for indexing a workpiece, the quantity of the wafer 25 and its size are detected. According to the detecting signal, a rotating means is driven and controlled and the index table 3 is intermittently rotated by a predetermined angle and a plurality of the wafers 25 is indexed to an exfoliating position by turns. At this exfoliating position, the cutter 49 of an exfoliating means 6 removes the wafer 25 from the plate 11 and the wager 25 is held by a chuck 8 from its rear side. Then, a handling means 9 transfers the chuck 8 to a discharge position and the wafer 25 is classified into a storing cassette 84. |
