| 摘要 |
Sputtering plants for the reactive coating of a substrate (6) with hard materials, especially with Ti nitride or Ti carbide, are known which have an evacuable housing at earth potential, which has a feeder for a reaction gas and a noble gas and in which the sputtering surface of a magnetron (5) serving as a sputtering unit and a holder for the substrate (6) are disposed, the substrate (6) being positioned, by means of the holder, in front of the sputtering surface. In order to increase the substrate stream, compared with conventional installations, the magnetron (5) has an anode made of a magnetisable material, there is arranged between the substrate (substrate holder 6) and the magnetron (5) an electrode (7) to which a positive voltage is applied, and the substrate has a negative voltage applied to it and has an electron gun (9) which injects an electron beam into the space behind the substrate as seen from the magnetron (5) in the direction of the substrate (6). <IMAGE>
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