| 摘要 |
PURPOSE:To set a die-bonding position accurately, by applying a laser light to the front end face of a luminant semiconductor chip along an axial line passing through a fixed point for reference of a stem, and by moving, on the other hand, the semiconductor chip to a position at which the output of a monitoring photodiode is maximum. CONSTITUTION:A laser light of a wavelength not involving the absorption by an active layer 4a is applied to the front end face of a luminant semiconductor chip 4 from a position-setting semiconductor laser 13, while the semiconductor chip 4 put on the top of a block 3 is absorbed by a vacuum chuck capillary 11 and moved in the vertical and horizontal ddirections with respect to an axial line C. When a luminant portion 4a' in the active layer 4a of the semiconductor chip 4 coincides with the axial line C passing through a fixed point 0 for reference of a stem 2, the laser light is transmitted to a monitoring photodiode 8 through the luminant portion 4a', and thus an output detector 12 detects an maximum output. By moving the semiconductor chip 4 to the position to which the output detector 12 detects the maximum output, therefore, a die- bonding position can beset accurately.
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