发明名称 Polyamic acid solution composition and polyimide film made therefrom.
摘要 <p>Disclosed is an aromatic polyamic acid solution composition comprising an aromatic polyamic acid dissolved in an amount of 5 to 40% by weight in an organic polar solvent. The aromatic polyamic acid is prepared by polymerizing substantially equimolar amounts of an aromatic tetracarboxylic acid component comprising 15 to 85 mole% of a biphenyltetracarboxylic acid or its functional derivative and 15 to 85 mole% of a pyromellitic acid or its functional derivative and an aromatic diamine component comprising 30 to 100 mole% of a phenylenediamine and 0 to 70 mole% of a diaminodiphenyl ether. The aromatic polyamic acid solution composition is formed into an aromatic polyimide film having a relatively small thermal expansion coefficient, high mechanical strength and good flexibility.</p>
申请公布号 EP0189643(A2) 申请公布日期 1986.08.06
申请号 EP19850308040 申请日期 1985.11.05
申请人 UBE INDUSTRIES, LTD. 发明人 SASAKI, YOSHIKAZU UBE INDUSTRIES, LTD;INOUE, HIROSHI UBE INDUSTRIES, LTD
分类号 B32B15/08;B32B15/088;C08G73/00;C08G73/10;C08J3/11;C08J5/18;C08L79/08;H05K1/03;(IPC1-7):C08G73/10 主分类号 B32B15/08
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