发明名称 FILM FORMING EQUIPMENT
摘要 PURPOSE:To prevent electric discharge in the part of work coil, by sealing and separating the inside of the work coil cover and the reaction chamber. CONSTITUTION:In the reaction chamber 3, the gas spouting nozzle 3 which gushes out the reaction gas is installed on the top of the pipe extending from the bottom, and the exhausting outlet 5 is installed on the base 2. In the reaction chamber 3, several wafers 6 on which films are to be formed are mounted on the susceptor 7. In the reaction vessel 1, the work coil cover 9 to cover the work coil 8 is installed, and at several parts outside the cover 9 the handles 10 are installed. Between the lower side of the work coil cover 9 and the base 2, the O-ring 11 made of rubber is put to seal and separate the reaction chamber 3 and the work coil cover 9. In the work coil cover 9, the inner cylinder 14 is installed which is provided with the bellows 12 and the O-rings 13 in the lower side, in order to seal the periphery of the nozzle 4 and the inside of the work coil cover 9 and separate them. Thus, the inside of the work coil cover 9 is more completely sealed.
申请公布号 JPS61171119(A) 申请公布日期 1986.08.01
申请号 JP19850010888 申请日期 1985.01.25
申请人 HITACHI LTD;HITACHI TOKYO ELECTRONICS CO LTD 发明人 FUJITA MASATO;TOMIZAWA SHUICHI;ISHIDA KAORU;SAKURAI YOSHIHIKO;AOYANAGI RYOICHI
分类号 H01L21/205;H01L21/31 主分类号 H01L21/205
代理机构 代理人
主权项
地址