发明名称 |
SEMICONDUCTOR DEVICES AND A SOLDER FOR USE IN SUCH DEVICES |
摘要 |
<p>A semiconductor device, for example a power rectifier, formed in a semiconductor body has a contact area coated with a metal layer of, for example, gold. A metallic member is soldered to the layer with an alloy comprising at least 80% lead, the balance being indium and silver in a ratio of at least 4:1 and at most 10:1. One such solder which has good wetting characteristics for improved bond strength contains approximately 92% lead, 7% indium, and 1% silver.</p> |
申请公布号 |
DE3271833(D1) |
申请公布日期 |
1986.07.31 |
申请号 |
DE19823271833 |
申请日期 |
1982.07.22 |
申请人 |
N.V. PHILIPS' GLOEILAMPENFABRIEKEN |
发明人 |
DAVIES, NEIL ANDREW;HUGHES, EDWARD THOMAS ELFED |
分类号 |
H05K3/34;B23K35/26;C22C11/00;H01L21/52;H01L21/58;H01L23/492;(IPC1-7):H01L23/48 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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