发明名称 PHOTOENGRAVING METHOD
摘要 PURPOSE:To prevent patterns on the top and reverse of a wafer from shifting in position by using a translucent plate where a substrate is stuck, forming the projection pattern of a clear mask on this translucent plate (glass plate), and facilitating glass matching with the glass plate. CONSTITUTION:For example,the wafer having a surface pattern 11 formed is stuck on the Cr vapor-deposited surface 13 of the glass plate 12 by using 'Apiezon(R)' 3 so that the pattern on the surface of the wafer 10 is seen through the glass plate 12. Then, resist 15 is applied over the surface of the glass plate 12 where the wafer 10 is stuck and a similar mask 14 is used as well as the surface of the wafer 10 to perform exposure so that the pattern of the wafer 10 is aligned through the glass plate 12. Then, only the periphery except the wafer 10 is dipped in a developer for development to form a pattern aligned to the surface pattern of the wafer 10 on the glass plate 12 at the periphery of the wafer 10. The surface of the glass plate 12 where the wafer 10 is stuck is exposed by using a mask 18 so that the pattern of the glass plate 12 is aligned, thereby forming a pattern on the reverse surface of the wafer 10. Thus, high-precision, efficient photoengraving is realized.
申请公布号 JPS61169850(A) 申请公布日期 1986.07.31
申请号 JP19850011997 申请日期 1985.01.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAHASHI SHOGO;OKITA SHIGEKI;OMURA ETSUJI
分类号 H01L21/30;G03F7/20;G03F9/00;H01L21/027 主分类号 H01L21/30
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