| 摘要 |
PURPOSE:To shorten the process and the time while to improve the accuracy and to prevent mixture of foreign matter by matching the center mark of drill with the referential mark of inner layer circuitboard corrected through X-ray permeating device then clamping the inner layer and drilling directly. CONSTITUTION:Drill mechanism 1 for boring an inner layer circuitboard vertically from the underside, X-ray generating device for searching a referential mark on said board and X-ray permeating device 5 comprised of X-ray ITV are arranged obliquely against the drill shaft 8. Pre-indicated drill center mark is matched with the referential mark on the inner layer circuitboard obtained by converting the picture image of referential mark on the inner layer circuitboard provided through X-ray permeating device and correcting through thinning, then the inner layer board is clamped by clamp mechanism 4 and drilled directly through the drill mechanism 1. Consequently, production process of inner layer circuitboard is shortened to shorten the time while to improve the accuracy and to prevent mixture of foreign matter. |
