| 摘要 |
PURPOSE:To provide the titled composition having high adhesivity and excellent moisture resistance and giving small stress to semiconductor element pellet, by adding an alkaline earth metal oxide and an organopolysiloxane having a specific group to an epoxy resin composition. CONSTITUTION:The objective composition is composed essentially of (A) an epoxy resin (a compound having >=2 epoxy groups in a molecule), (B) a novolac- type phenolic resin, (C) an alkaline earth metal oxide (preferably CaO, CaO2, BaO or BaO2 having a particle diameter of 0.01-3mu), (D) an organopolysiloxane having epoxy group, amino group, carboxyl group, OH group and/or cyano group in the molecule [e.g. the compound of formula I or II (R<3> is alkyl or phenyl; X is group of formula III, etc.), etc.], and (E) 30-90wt% inorganic filler (preferably silica or alumina).
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