| 摘要 |
PURPOSE:To enable to apply a proper load even when there are some bump electrodes high in height among bump electrodes and to enable to attain it in order to be formed into an alloy to the other bump electrodes as well under a proper load by a method wherein the tape carrier bonder shall be provided with a bonding tool, a pellet placing stand and a bonding tool adjusting means. CONSTITUTION:In the tape carrier bonder, a bonding tool 2 is provided in the upper direction of a pellet placing stand 1, a vertical driving means 3 is connected to the bonding tool 2, and moreover, an air cylinder 4, which is a bonding load adjusting means, is provided between both of the bonding tool 2 and the vertical driving means 3 as the load adjusting part. The bonding tool 2 is brought into contact to bump electrodes in a low load at first and can be made to increase its load gradually. Accordingly, even though a pellet among pellets is a pellet 5 provided with bump electrodes 5a, whose heights are not constant, or even though the pellet is a pellet 5a provided with numerous electrodes to need a large bonding load in total, the bonding tool 2 is brought into contact to some bump electrodes 5a high in height under a low load at first, is made to increase its load gradually with the progress of being formed into an alloy of the bump electrodes, and finally, can be made into the desired load. |
