| 摘要 |
PURPOSE:To provide brazability to an amorphous alloy which is plated with one or plural kinds of copper, nickel, tin, zinc or tin-lead solder by dipping said amorphous alloy into molten solder to form a solder layer having good adhesiveness on the surface. CONSTITUTION:The amorphous alloy is dipped into a soln. prepd. by compounding an amphoteric surface active agent and amine corrosion inhibitor with adequately compounded hydrochloric acid, sulfuric acid, citric acid, acetic acid and nitric acid by which the surface thereof is cleaned. The surface is then electrolyzed and activated in the liquid prepd. by compounding the amphoteric surface active agent and amine corrosion inhibitor with adequately compounded phosphoric acid, sulfuric acid, citric acid and acetic acid. The alloy is thereafter subjected to plating of one or plural kinds of the copper, nickel, tin, zinc or tin-lead solder. The alloy is then dipped into molten solder to form the solder layer having good adhesiveness on the surface. The soldering of the amorphous alloy which is impossible to be adhered as the alloy is amorphous is made possible and the use thereof is expanded.
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