| 摘要 |
PURPOSE:To machine the surface of a wafer with high accuracy by finishingly grinding the surface of said wafer after carrying out rough grinding. CONSTITUTION:After wafers 3 are delivered in order from a loader 4 onto the wafer chuck table 2 on a defined position of a rotary table 1 by means of a delivery mechanism, the wafer 3 is fixed and held with its circuit-formed surface faced up, on this table 2 by means of vacuum adsorption. The wafer 3 thus fixed and held is subjected to rough grinding by means of a cup wheel 9 of a rough grinding mechanism 6 while the rotary table 1 is rotated at a certain angle. Then, by further rotating the rotary table 1 at a certain angle, the wafer 3 is subjected to a plane surface grinding accurately by means of a straight grinding stone 11 during this rotation.
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