发明名称 |
HIGH DENSITY ARAMID PAPER |
摘要 |
High density para-aramid papers comprising 5 to 25 percent, by weight, binder and an amount of para-aramid fibers selected from the group consisting of para-aramid pulp, para-aramid floc and mixtures thereof, compacted to provide a volume percent para-aramid fiber of at least 53 minus 0.13 times the volume percent floc in the paper are useful in the preparation of circuit board substrates having a low coefficient of thermal expansion. |
申请公布号 |
JPS61160500(A) |
申请公布日期 |
1986.07.21 |
申请号 |
JP19850230062 |
申请日期 |
1985.10.17 |
申请人 |
E I DU PONT DE NEMOURS & CO |
发明人 |
EDOWAADO UIRIAMU TOKARUSUKII |
分类号 |
D21H13/26;D01F6/60;D21H;D21H17/46;H05K;H05K1/03 |
主分类号 |
D21H13/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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