| 摘要 |
PURPOSE:To reduce the cost of soldering by forming an electrolytic Ni plating layer having a specific thickness to the surface of iron parts then subjecting the parts to a heat treatment in a nitrogen atmosphere, etc. to diffuse partly the electrolytic Ni plating layer into the iron base. CONSTITUTION:A part cap 9 is manufactured by molding of an iron plate and the electrolytic Ni plating layer 16 is formed over the entire surface thereof to >=5mu thickness. The cap 9 is then heat-treated for about 10-30min at about 800-1,600 deg.C in a nitrogen or hydrogen atmosphere. The Ni constituting the plating layer 16 diffuses partly into the iron base constituting the cap 9 to form a Ni-diffused layer 17 and the remaining Ni remains as the electrolytic Ni plating layer 16' on the cap 9. Pinholes are eliminated by the heat treatment if the soldering is executed in this state and therefore the thinner Ni plating layer is required.
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