| 摘要 |
PURPOSE:To eliminate the unbalance of insertion resistance as well as to limit the pitch between the IC leads within the allowable value by a method wherein the overall deformation of the IC leads is shaped using a pair of comb type shaping plates and the local deformation of the leads is shaped using the shaping block having shaping holes. CONSTITUTION:The IC is held by a holding plate 8. Comb type shaping plates 5 and 5a are inserted in the roots of leads 3 from the orthogonally intersecting two directions to the leads 3, the comb type shaping plates 5 and 5a are made to move downward in a state that this one pair of comb type shaping plates 5 and 5a are holding the respective leads 3 between them and a shaping of the leads 3 is performed. When the shaping ends, the shaping plates 5 and 5a are both made to back, the upper part of the can case 1 of the IC set on the holding plate 8 is pushed down by a clamper 9 and a shaping block 6 performs the correction of local deformation of the lends 3 while pushing the leads 3 down in such a way as to make the leads 3 fit in the holes 7 thereof. When the shaping ends, the shaping block 6 is pulled down. |
