发明名称 Heat pump device for temperature regulation and ventilation of a locale
摘要 Heat pump device for temperature regulation and ventilation of a locale. The device comprises a cooling medium circuit (1), whose condenser (H1) is in thermal-transmitting contact with the airflow in a supply air unit (2) and whose evaporator (H2) is in thermal-transmitting contact with the extract air from the locale. The condenser (H1) is situated in a flow device (16) with bypass line (20) that is housed in the supply air unit (2). A separate damper is used to divide the total supply air between the condenser (H1) and the bypass line (20) so that the condenser temperature is maintained at the desired level so the heat pump can work with great efficiency under various operation conditions.<IMAGE>
申请公布号 SE445773(B) 申请公布日期 1986.07.14
申请号 SE19830002895 申请日期 1983.05.20
申请人 OWE * ZACKRISSON;LENNART * OHLSSON 发明人 OWE * ZACKRISSON;LENNART * OHLSSON
分类号 F24F11/02 主分类号 F24F11/02
代理机构 代理人
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