发明名称 APPARATUS FOR WASHING WAFER UNDER REDUCED PRESSURE WITH RUNNING WATER
摘要 PURPOSE:To prevent air bubbles from adhering on the surface of an object to be washed and to improve th washing efeiciency, by washing the object with running water under a reduced pressure. CONSTITUTION:A cover 11a is removed and a casette 17 holding silicon wafers 18, 18... is received in a washing tank 16. A draining on-off valve 15 and an air supply on-off valve 24 are closed while an air exhaust on-off valve 22 is opened, and a vacuum apparatus is driven to evacuate a washing chamber 11. The degree of vacuum is regulated to an arbitrary pressure from several tens to several hundreds torrs by means of s vacuum regulating throttle valve 26. A water supply tube 21 is then caused to start supply of water to wash the silicon wafers 18, 18.... Since the silicon wafers are washed under a reduced pressure, any air bubbles adhering on the surface of the silicon wafers can be removed rapidly.
申请公布号 JPS61154130(A) 申请公布日期 1986.07.12
申请号 JP19840278252 申请日期 1984.12.27
申请人 TOSHIBA CORP 发明人 ONO ICHI
分类号 B08B3/04;H01L21/304 主分类号 B08B3/04
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