| 摘要 |
PURPOSE:To make the laying length of a bonding wire the predetermined value by detecting a slip of the actual mounting position of a semiconductor device from the theoretical position followed by correcting the bonding point on the stem side and further laying the bonding wire at the height of a theoretical loop. CONSTITUTION:An element 21 fixed on a frame 20 is mounted on a stem 22. The actual mounting position O2 of the element 21 is detected and a quantity of a slip from the theoretical position O1 is calculated, thereby determining the corrected bonding point. If a bonding wire 23a1 is laid from the first bonding point 241 on the element 21 to the second bonding point 251 on the stem 22 side, the point is corrected to be the third bonding point 27 corresponding to a quantity of the slip of the point 251. Under these conditions, a height of a loop is predetermined to be a theoretical value and a bonding wire 23a2 is laid. As a result, a length of laying of the wire 23a2 can be made just as the theoretical value and the variation of a resistance value can be made the predetermined value. After that, the all bonding wires are similarly laid in the corrected bonding points. |
