摘要 |
PURPOSE:To obtain a small-sized device by each connecting an NPN element and a PNP element to a chip bed, a mount thereof is connected to one part of a plurality of terminal leads, by collectors. CONSTITUTION:Chips (21, 24), (22, 25), (23, 26) for NPN elements and PNP elements are connected and mounted to each of chip beds 31-33 by collectors, and the beds are connected severally to terminals 3, 6, 9. Bases in respective element are connected to terminals (2, 5, 8) for adjacent NPN elements and terminals (4, 7, 10) for the PNP elements. Emitters in the NPN elements 21-23 are connected to a terminal 11 according to a conductive pattern and emitters in the PNP elements 24-26 to a terminal 7 according to a conductive pattern. According to the constitution, the number of leading-out terminals can be reduced, a package is miniaturized, and connections by an external circuit of the collectors are also omitted, thus further miniaturizing the device. |